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 PI6C184
21098765432121098765432109876543210987654321210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 21098765432121098765432109876543210987654321210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321
Precision 1-13 Clock Buffer
Description
The PI6C184 is a high-speed low-noise 1-13 non-inverting buffer designed for SDRAM clock buffer applications. This buffer is intended to be used with the PI6C104 clock generator for Intel Architecture for both desktop and mobile systems. At power-up, all SDRAM outputs are enabled and active. The I2C Serial control may be used to individually activate/deactivate any of the 13 output drivers. Note: Purchase of I2C components from Pericom conveys a license to use them in an I2C system as defined by Philips(R).
Features
* High-speed, low-noise, non-inverting, 1-13 buffer * Supports up to four SDRAM DIMMs * Low skew (< 250ps) between any two output clocks * I2C Serial Configuration interface * Multiple VDD, VSS pins for noise reduction * 3.3V power supply voltage * Separate Hi-Z pin for testing * Packaging (Pb-free & Green available): - 28-pin SSOP (H)
Block Diagram
Pin Configuration
SDRAM0
VDD
SDRAM1 BUF_IN SDRAM2
1 2 3 4 5 6 7 8 9 10 11 12 13 14
28 27 26 25 24 23 22 21 20 19 18 17 16 15
VDD SDRAM11 SDRAM10 VSS VDD SDRAM9 SDRAM8 VSS VDD SDRAM7 SDRAM6 VSS VSS SCLK
SDRAM0 SDRAM1 VSS VDD SDRAM2
SDRAM3
SDRAM3 VSS BUF_IN
SDRAM12
SDRAM4 SDRAM5 SDRAM12
SDATA SCLK
I2C I/O
VDD SDATA
1
PS8320D
10/14/04
PI6C184 Precision 1-13 Clock Buffer
21098765432121098765432109876543210987654321210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 21098765432121098765432109876543210987654321210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321
Pin Description
Pin 2 , 3 , 6 , 7 , 1 0 , 11 , 1 8 , 1 9 26,27,12 22,23 9 14 15 1,5,13,20,24,28 4,8,16,17,21,25 S y mbo l S DRAM [0 . 7 ] S DRAM [1 0 . 1 2 ] S DRAM [8 . 9 ] BUF _ IN S DATA S C LK VDD VSS Ty pe 0 0 0 1 I /O I /O P o wer Gro und Qua ntity 8 3 2 1 1 1 6 6 D e s criptio n S DRAM Byte 0 clo ck o utp ut S DRAM Byte 1 clo ck o utp ut S DRAM Byte 2 clo ck o utp ut Inp ut fo r 1 - 1 3 - b uffer Data p in fo r I2C circuitry. Has a 1 0 0 k Internal p ull- up resisto r C lo ck p in fo r I2C circuitry. Has a 1 0 0 k Internal p ull- up resisto r 3 . 3 V p o wer sup p ly fo r S DRAM b uffer Gro und fo r S DRAM Buffers
Serial Configuration Map
Byte0: SDRAM Active/Inactive Register (1 = enable, 0 = disable)
Bit Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Pin # 19 18 11 10 7 6 3 2 De s cription SDRAM7 (Active/Inactive) SDRAM6 (Active/Inactive) SDRAM5 (Active/Inactive) SDRAM4 (Active/Inactive) SDRAM3 (Active/Inactive) SDRAM2 (Active/Inactive) SDRAM1 (Active/Inactive) SDRAM0 (Active/Inactive)
I2C Address Assignment
A6 1 A5 1 A4 0 A3 1 A2 0 A1 0 A0 1 R/W 0
Note: Inactive means outputs are held LOW and are disabled from switching
2
PS8320D
10/14/04
321098765432121098765432109876543210987654321210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321
PI6C184 Precision 1-13 Clock Buffer
2-Wire I2C Control
The I2C interface permits individual enable/disable of each clock output and test mode enable. The PI6C184 is a slave receiver device. It can not be read back. Sub addressing is not supported. All preceding bytes must be sent in order to change one of the control bytes. Every bite put on the SDATA line must be 8-bits long (MSB first), followed by an acknowledge bit generated by the receiving device. During normal data transfers SDATA changes only when SCLK is LOW. Exceptions: A HIGH-to-LOW transition on SDATA while SCLK is HIGH indicates a "start" condition. A LOW-to-HIGH transition on SDATA while SCLK is HIGH is a "stop" condition and indicates the end of a data transfer cycle. Each data transfer is initiated with a start condition and ended with Byte1: SDRAM Active/Inactive Register (1 = enable, 0 = disable)
Bit Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 12 27 26 Pin # De s cription NC (Initialize to 0) NC (Initialize to 0) NC (Initialize to 0) NC (Initialize to 0) NC (Initialize to 0) SDRAM12 (Active/Inactive) SDRAM11(Active/Inactive) SDRAM10 (Active/Inactive)
a stop condition. The first byte after a start condition is always a 7-bit address byte followed by a read/write bit. (HIGH = read from addressed device, LOW= write to addressed device). If the device's own address is detected, PI6C184 generates an acknowledge by pulling SDATA line LOW during ninth clock pulse, then accepts the following data bytes until another start or stop condition is detected. Following acknowledgement of the address byte (D2), two more bytes must be sent: 1. "Command Code" byte, and 2. "Byte Count" byte. Although the data bits on these two bytes are "don't care," they must be sent and acknowledged. Byte2: Optional Register for Possible Future Requirements (1 = enable, 0 = disable)
Bit Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Pin # 23 22 De s cription SDRAM9 (Active/Inactive) SDRAM8 (Active/Inactive) (Reserved) (Reserved) (Reserved) (Reserved) (Reserved) (Reserved)
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ............................................... -65C to +150C Ambient Temperature with Power Applied ................. -0C to +70C 3.3V Supply Voltage to Ground Potential .................. -0.5V to +4.6V DC Input Voltage ....................................................... -0.5V to +4.6V
Note: Stresses greater than those listed under MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Supply Current (VDD = +3.465V, CLOAD = Max.)
S ymbo l IDD IDD IDD Pa ra me te r S up p ly C urrent S up p ly C urrent S up p ly C urrent Te s t Co nditio n BUF _IN = 0 MHz BUF _IN = 6 6 . 6 6 MHz BUF _IN = 10 0 . 0 MHz M in. Typ. M ax. 3 230 360 mA Units
3
PS8320D
10/14/04
PI6C184 Precision 1-13 Clock Buffer
21098765432121098765432109876543210987654321210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 21098765432121098765432109876543210987654321210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321
DC Operating Specifications (VDD = +3.3V 5%, TA = 0C - 70C)
Symbol Input Voltage VIH VIL IIL VOH VOL COUT CIN LPIN TA Input high voltage Input low voltage Input leakage current Output high voltage Output low voltage Output pin capacitance Input pin capacitance Pin Inductance Ambient Temperature No Airflow 0 0 < VIN < VDD IOH = - 1mA IOL = 1mA VDD 2.0 VSS -0.3 -5 2.4 0.4 6 5 7 70 VDD +0.3 0.8 +5 V mA Parame te r Te s t Condition M in. M a x. Units
VDD[0- 9] = 3.3V 5% V pF nH C
SDRAM Clock Buffer Operating Specification
Symbol IOHMIN IOHMAX IOLMIN IOLMAX tRHSDRAM tTHSDRAM Parame te r Pull- up current Pull- up current Pull- down current Pull- down current Output rise edge rate SDRAM only Output fall edge rate SDRAM only Te s t Conditions VOUT = 2.0V VOUT = 3.135V VOUT = 1.0V VOUT = 0.4V 3.3V 5% @ 04V- 2.4V 3.3V 5% @ 2.4V- 0.4V 1.5 1.5 54 53 4 4 V/ns M in. -54 -46 mA Typ. M ax. Units
AC Timing
Symbol 66 MHz Min. Max. TDSKP SDRAM CLK period 15.0 15.5 TSDKH SDRAM CLK high time 5.6 TSDKL SDRAM CLK low time 5.3 TSDRISE SDRAM CLK rise time 1.5 4.0 TSDFALL SDRAM CLK fall time 1.5 4.0 t PLH SDRAM Buffer LH prop delay 1.0 5.5 t PHL SDRAM Buffer HL prop delay 1.0 5.5 DutyCycle Measured at 1.5V 45 55 tSDSKW SDRAM Output to Output Skew 250 Parameter 100 MHz Min. Max. 10.0 10.5 3.3 3.1 1.5 4.0 1.5 4.0 1.0 5.0 1.0 5.0 45 55 250 Units ns ns ns V/ns V/ns ns ns % ps
4
PS8320D
10/14/04
321098765432121098765432109876543210987654321210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321
Output Buffer Test Point Test Load
PI6C184 Precision 1-13 Clock Buffer
tSDKP tSDKH
3.3V Clocking Interface (TTL)
2.4 1.5 0.4 tSDKL tSDRISE tSDFALL
Input Waveform tplh Output Waveform
1.5V
1.5V tphl 1.5V 1.5V
Figure 1. Clock Waveforms
Minimum and Maximum Expected Capacitive Loads
Clock SDRAM M in. Load 20 M ax. Load 30 Units pF Note s SDRAM DIMM Specification
Notes: 1. Maximum rise/fall times are guaranteed at maximum specified load. 2. Minimum rise/fall times are guaranteed at minimum specified load. 3. Rise/fall times are specified with pure capacitive load as shown. Testing is done with an additional 500 resistor in parallel.
Design Guidelines to Reduce EMI
1. Place series resistors and CI capacitors as close as possible to the respective clock pins. Typical value for CI is 10pF. Series resistor value can be increased to reduce EMI provided that the rise and fall time are still within the specified values. 2. Minimize the number of "vias" of the clock traces. 3. Route clock traces over a continuous ground plane or over a continuous power plane. Avoid routing clock traces from plane to plane (refer to rule #2). 4. Position clock signals away from signals that go to any cables or any external connectors.
5
PS8320D
10/14/04
PI6C184 Precision 1-13 Clock Buffer
21098765432121098765432109876543210987654321210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 21098765432121098765432109876543210987654321210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321
PCB Layout Suggestion
C1 VDD 1 2 3 VSS VDD 4 5 6 7 VSS 8 9 10 11 12 VDD 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VSS VDD VSS VSS VDD VDD
C4 Ferrite Bead VCC
C7 C5 22F
C2
C6
Via to GND Plane
C3
Via to VDD Plane VSS Void in Power Plane
Note: This is only a suggested layout. There may be alternate solutions depending on actual PCB design and layout. As a general rule, C1-C7 should be placed as close as possible to their respective VDD.
Recommended capacitor values: C1-C7 ................. 0.1F, ceramic C8 ..................... 22F
PI6C184
100/66 MHz Clock from Chipset
22 SDRAM CL
13
SDRAM DIMM Spec.
Figure 2. Design Guidelines
6
PS8320D
10/14/04
321098765432121098765432109876543210987654321210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321
PI6C184 Precision 1-13 Clock Buffer
Packaging Mechanical: 28-pin SSOP (H)
Ordering Information
Ordering Code PI6C184H PI6C184HE Package Code H H Package Type 28-pin SSOP Pb-free & Green, 28-pin SSOP
Notes: 1. Thermal characteristics can be found on the company web site at www.pericom.com/packaging/
Pericom Semiconductor Corporation * 1-800-435-2336 * www.pericom.com
7
PS8320D 10/14/04


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